发明名称 PLASMA TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus where strong uniform plasma treatment is conducted over a large area, plasma treatment in arbitrary distribution can be made, and apparatus costs are low. SOLUTION: A plurality of microwave generators are used, and microwaves are independently supplied into a chamber for generating plasma, thus easily adjusting plasma distribution. Additionally, a practically sufficient operation can be secured by a simple configuration without tuner. Further, the plasma distribution can be freely adjusted by providing the plurality of compact microwave generators, and plasma treatment having further uniform or specific distribution as compared with a conventional one can be conducted. In addition, by heating and controlling a plurality of systems of heaters independently, specific temperature distribution is given to a placed object to be treated, and the distribution of the plasma treatment of the object to be treated can be corrected.
申请公布号 JP2003142460(A) 申请公布日期 2003.05.16
申请号 JP20010338950 申请日期 2001.11.05
申请人 SHIBAURA MECHATRONICS CORP 发明人 TSUGAMI YOSHIZO;IVAN PETROV GANASHEV
分类号 H05H1/46;H01L21/302;H01L21/3065 主分类号 H05H1/46
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