LAMINATOR EQUIPMENT FOR GRINDING BACKSIDE OF WAFER AND OPERATING METHOD THEREOF

摘要

PURPOSE: Laminator equipment for grinding the backside of a wafer and an operating method thereof are provided to reduce the size of the equipment and tape bonding time, and to restrain the damage of the wafer by carrying out a plurality of processes at a single position. CONSTITUTION: Laminator equipment(100) is provided with a loading and unloading unit(102) for placing a wafer cassette, a robot arm(104) for transferring a wafer from the wafer cassette located at the loading and unloading unit(102) to an alignment table, and an alignment/bonding/cutting unit(106) for carrying out an alignment/tape bonding/tape cutting process only at the alignment table without transferring the wafer to a plurality of positions.