发明名称 APPARATUS AND METHOD FOR FORMING RESIST PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a resist-pattern forming apparatus which eases compensation work for compensation parameters that respond to measurement data on measurement items, such as resist film thickness and developed linewidth. SOLUTION: This resist-pattern forming apparatus comprises a coating/ developing apparatus 100, which comprises a coating unit 3A and a developing unit 3B and to which an exposure apparatus 200 is connected, and a parameter control unit 8 that controls these processes, where inspection units respectively inspect reflectance of the underlying film, resist-film thickness, developed linewidth, and the like. These measured data are inputted to a data-collection controller 7 from respective inspection units. The data-collection controller 7 transmits the data to the parameter control unit 8. In the control unit 8, compensation parameters are selected, based on the measured data on the measurement items, such as the resist-film thickness, and the compensation for the compensation parameters are conducted. The compensated parameters are transmitted to respective process units via the data-collection controller 7.
申请公布号 JP2003142374(A) 申请公布日期 2003.05.16
申请号 JP20010338229 申请日期 2001.11.02
申请人 TOKYO ELECTRON LTD 发明人 KIYOTA MAKOTO;TANAKA MICHIO;AIUCHI TAKASHI;KAMIMURA RYOICHI
分类号 G03F7/30;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/30
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