| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic mounting method for a flip chip by the use of a reinforcing agent for preventing the dislocation of an IC chip in its unstable state immediately after the application of ultrasonic vibration. SOLUTION: An adhesive resin sheet 1 is placed between an IC chip 204 and a circuit substrate 104, and bumps 206 on the chip 204 and electrodes 105 on the substrate 104 are aligned with each other. The chip 204 is then pressed against the substrate 104 and, at the same time, heat and ultrasonic vibration are applied to them. Both sides of the semi-hardened adhesive resin sheet 1 stick the surfaces of the chip 204 and the substrate 104. The design prevents the dislocation of the chip 204 immediately after the application of ultrasonic vibration and enables the accurate bonding of the chip 204 to the desired location. |
