METHOD OF FORMING BUMP, FLIP CHIP, SEMICONDUCTOR DEVICE, THEIR MANUFACTURING METHODS, CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a bump by which a partly thickened bump and composed of low-melting point metal can be formed easily. SOLUTION: After at least one layer is formed on a pad 12 so that an outermost layer becomes a first brazing material layer 28, a metallic layer 32 and a second brazing material layer 36 are successively formed on the brazing material layer 28. The second brazing material layer 36 is formed by displacement plating by which a brazing material is precipitated by melting the metallic layer 32 which becomes a basis material.