| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting method for a chip component which can easily provide cream solder on respective lands at low cost and easily evade mounting defects. SOLUTION: A substrate 1 provided with a wiring pattern 2 having lands 3 is prepared and, after a resist layer (of >=50μm in thickness) which has openings 4a for exposing the land parts 3 and has a flat surface is formed on the substrate by coating, the cream solder 5 is squeezed by using the top surface of the resist layer 4 as a squeezing surface to charge the cream solder 5 in the openings 4a. Then the chip component 6 is mounted on the resist layer 4 and, while an electrode 6a of the chip component 6 is brought into contact with the cream solder 5, the substrate 1 is heated in a reflow furnace to solder the electrode 6a of the chip component 6 to the land 4 through the fused cream solder 5.</p> |
