| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing unit which is capable of cutting and cleaning a wafer efficiently and rotating a table at a high speed in a cleaning process. SOLUTION: A cleaning water jet device 54 forming a spinner cleaning device is provided to a dicing unit 10, a table 12 holding a wafer 14 is used in common in both cutting and cleaning, cleaning water is jetted out from the cleaning water jet device 54 against the wafer 14 subjected to cutting while the wafer 14 is held on the table 12, so that a transfer process of transferring the wafer 14 subjected to cutting to a spinner cleaning device can be dispensed with. Furthermore, two motors of a hollow motor 16 rotating the table 12 when the wafer 14 is cut and a servo motor 90 rotating the table 12 when the wafer 12 is subjected to spinner cleaning are used. The servo motor 90 is moved up or down by a spring 100 corresponding to cutting or cleaning so as to be engaged with or disengaged from the table 12 so that the hollow motor 16 suitable for positioning can be used when the wafer 14 is cut, and the servo motor 90 suitable for high-speed rotation can be used when the wafer 14 is subjected to spinner cleaning. |
