SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: To provide a semiconductor device in which connection reliability and stability are improved when a bonding wire is bonded to a bonding pad in a semiconductor device with a multilayer wiring structure using a copper wire, and a method of manufacturing the same. CONSTITUTION: A third layer wire 17 and a bonding pad 71, both of which are made of aluminum alloys, are partially formed on a second interlayer insulating film 14. An open hole 74 having a bottom surface defined by the bonding pad 71 is partially formed in a third interlayer insulating film 63, fourth interlayer insulating film 67, protection insulating film 72 and buffer coating film 73. A bonding wire 75 is inserted through the open hole 74 and bonded to the bonding pad 71.