BARRIER LAYER FOR SEMICONDUCTOR WAFER INTERCONNECTION STRUCTURE AND METHOD OF DEPOSITING BARRIER LAYER

摘要

PROBLEM TO BE SOLVED: To provide a barrier layer for the interconnection structure of a semiconductor wafer and a method of depositing the barrier layer. SOLUTION: The interconnection structure of a semiconductor device contains a tungsten plug (14) deposited in a via or a contact window (11). A barrier layer (15) isolates the tungsten plug (14) from the surface of a dielectric material (16), and the contact window or the via (11) is formed inside the surface of the dielectric material (16).