PEN WITH WRITING PRESSURE ADJUSTING MECHANISM FOR ENGRAVING LETTER ON WAFER

摘要

PROBLEM TO BE SOLVED: To provide a pen for engraving letters on a wafer by which fluctuation of writing pressure of an operator is absorbed to perform uniform engraving of the letters and when an excessive writing pressure is applied on a pen point, the wafer is prevented from being broken. SOLUTION: In the pen 31 for engraving letters on the wafer, a spring 37 and spring receivers 38a and 38b are stored in a joint part 33 and a spring 39 and spring receivers 40a and 40b are stored in a cap 34. The spring 37 is for adjusting the writing pressure applied on a pen point 36 and the spring 39 is for storing the pen point 36 in the cap 34 when the excessive writing pressure is applied on the pen point 36.