发明名称 |
DETERGENT COMPOSITION |
摘要 |
To provide a detergent composition which has little corrosion to a wiring material and is excellent in cleaning ability of a semiconductor substrate or semiconductor device on which the fine particles and the metal impurities are deposited. A detergent composition comprising a reducing agent, wherein the detergent composition has an oxidation-reduction potential at 25 DEG C of +0.2 V or less, and a pH at 25 DEG C of from 3 to 12; and a cleaning process of a semiconductor substrate or a semiconductor device using the detergent composition.
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申请公布号 |
EP1310989(A1) |
申请公布日期 |
2003.05.14 |
申请号 |
EP20010941051 |
申请日期 |
2001.06.14 |
申请人 |
KAO CORPORATION |
发明人 |
SAKAI, AKIMITSU;TAMURA, ATSUSHI |
分类号 |
C11D3/00;C11D7/02;C11D7/26;C11D7/34;C11D11/00;C23G1/20;H01L21/306;(IPC1-7):H01L21/304 |
主分类号 |
C11D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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