| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for producing a conductive layer laminated material which can reduce or exclude the formation of a fragile alloy layer on a junction interface associated with a high temperature process and an undesirable influence such as large residual stress associated with high rolling rate junction and a method for producing a part using the laminated material. SOLUTION: The surfaces to be joined of the laminated material in which an insulating layer is laminated on the first conductive layer and the second conductive layer are subjected to activation treatment. The activated surfaces are arranged to face each other and laminated and joined together to produce the conductive layer laminated material. The part applicable to a printed wiring board, an IC package, etc., is produced by using the conductive layer laminated material.</p> |
