| 摘要 |
The present invention discloses a light source of full color LED (light emitted diode) by using die bond and packaging technology. A first mono-color LED chip with reflective metal on the bottom and transparent metal-oxide on the top of the chip is bonded on the PC board by thermal or ultrasonic die bond. A second mono-color LED chip with reflective metal on both sides is bonded in cascade on the first LED chip by thermal or ultrasonic die bond. The first LED chip emits light through the transparent metal-oxide to mix with the second LED light such that a different color light will obtain. The reflective metal reflects all the light to enforce the light intensity. In near field application, a red, a blue and a green LED are die bond in cascade to get a white light or full color light. In far field application, a yellow and a blue LED are die bond in cascade on the PC board, in its side is another cascaded die bond of a red and a green LED to get a white light or full color light.
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