发明名称 Method and apparatus for improving accuracy in photolithographic processing of substrates
摘要 This invention provides a method and apparatus for depositing a silicon oxide film over an antireflective layer to reduce footing experienced in the a subsequently applied photoresist layer without substantially altering the optical qualities of the antireflective layer. The invention thereby provides more accurate etching of underlying layers during patterning operations. The invention is also capable of providing more accurate patterning of thin films by reducing inaccuracies caused by excessive etching of photoresist during patterning. Additionally, the film of the present invention may be patterned and used as a mask in the patterning of underlying layers.
申请公布号 US6562544(B1) 申请公布日期 2003.05.13
申请号 US19960743628 申请日期 1996.11.04
申请人 APPLIED MATERIALS, INC. 发明人 CHEUNG DAVID;FENG JOE;HUANG JUDY H.;YAU WAI-FAN
分类号 G03F7/11;G03F7/09;G03F7/26;H01L21/027;H01L21/033;H01L21/302;H01L21/3065;H01L21/308;H01L21/768;H01L23/522;(IPC1-7):G03F7/00;H01L21/28 主分类号 G03F7/11
代理机构 代理人
主权项
地址