发明名称 Method of forming a semiconductor device using selective epitaxial growth
摘要 A method of forming a semiconductor device using selective epitaxial growth (SEG) is provided. This method includes forming an insulating layer pattern having a window on a semiconductor substrate. The window exposes a predetermined region of the semiconductor substrate. The substrate having the window is cleaned, thereby removing any native oxide layer on the exposed substrate. The cleaned substrate is oxidized. Accordingly, a sacrificial oxide layer is formed thereon. The sacrificial oxide layer is removed. Thus, the exposed substrate has substantially no crystalline defects. A single crystalline semiconductor layer is then grown on the exposed substrate using SEG.
申请公布号 US6562707(B2) 申请公布日期 2003.05.13
申请号 US20020043942 申请日期 2002.01.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 RYU JONG-RYOL;PARK JUNG-WOO;HA JUNG-MIN;CHOI SI-YOUNG
分类号 H01L21/3063;H01L21/20;H01L21/285;H01L21/306;H01L21/336;H01L21/768;H01L29/78;(IPC1-7):H01L21/320;H01L21/476;H01L21/302;H01L21/461 主分类号 H01L21/3063
代理机构 代理人
主权项
地址
您可能感兴趣的专利