SUBSTRATE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE USING THE SAME, AND LAMINATED STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a substrate for semiconductor devices, a semiconductor device using the same and a laminated structure which facilitates the checking of types of devices mounted in laminated semiconductor packages and the number of semiconductor devices even after the assembly of the laminated structure. SOLUTION: A substrate 11 has notches 15a, 15b at its external periphery. The notch 15a locates at a different position on the same side of the substrate 11 by each function of a mounted semiconductor chip 13. The notch 15b is formed to show the number of laminated semiconductor packages 10 in the laminate structure.