| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board where a solder-resistant resin layer has superior chemical resistance and reliability is excellent in the connection between a solder junction pad and solder. SOLUTION: In the wiring board 4, a solder-resistant resin layer 3 is deposited by crosslinking reaction. The solder-resistant resin layer 3 has an opening 5 for allowing the center section of the solder junction pad 2 to be exposed onto an insulating board 1 with the solder junction pad 2 deposited thereon. In the solder-resistant resin layer 3, a reaction rate in the crosslinking reaction group is at least 90%, and at the same time arithmetic average roughness on the surface is equal to or less than 0.1μm. Furthermore, in the solder-resistant resin layer 3, crosslinking density is high, and at the same time smoothing properties on the surface are superb, thus achieving excellent chemical resistance.
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