ELECTROLESS SILVER PLATING SOLUTION AND METHOD FOR FABRICATING METAL INTERCONNECTION USING THE SAME

摘要

PURPOSE: A method for fabricating a metal interconnection using an electroless silver plating solution is provided to improve electrical conductivity of the interconnection by easily forming a silver-containing continuous flat thin film of a good quality. CONSTITUTION: A semiconductor substrate is prepared. A cleaning process is performed on the semiconductor substrate. The semiconductor substrate is sensitized. A catalyst layer is formed on the semiconductor substrate. An electroless plating process is carried out regarding the semiconductor substrate by using the electroless plating solution.