THIN FILM FORMING APPARATUS AND METHOD THEREFOR

摘要

PURPOSE: To provide a thin film forming apparatus and a method which can easily be adapted for an automatic process and can form a thin film on a substrate at a lower running cost. CONSTITUTION: Under the condition that a thin film forming surface 12 of substrate is provided opposed to an insulation film 21 formed at the surface of a quartz plate 2, the insulation film 21 is closely stuck to the thin film forming surface 12 through mutual approximate movement to the substrate 1 and quartz plate 2 (step S3: close sticking process). Only the quartz plate 2 is selectively peeled to complete the transfer of the insulation film 21 to the substrate 1 (step S4: peeling process). Accordingly, the insulation film 21 is formed on the thin film forming surface 12 of the substrate and the substrate 1 is accommodate into a substrate cassette with a transfer mechanism. Meanwhile, after the quartz plate 2 is transferred to a cleaning unit by the transfer mechanism and then cleaned (step S5: cleaning process), the quarts plate 2 is returned to a plate member cassette and then stored therein until the plate is re-used.