| 摘要 |
PURPOSE: An electrolytic copper foil for printing circuit board and secondary battery electrode collector and a method for manufacturing the same are provided to control roughness of both surfaces of the electrolytic copper foil according to electrolyte additives and control the amount thereof so that strength is not rapidly changed even at a high temperature. CONSTITUTION: In an electrolytic copper foil formed by electrodepositing copper on a drum using electrolyte, the electrolytic copper foil is characterized in that the electrolytic copper foil is contacted with the drum to form glossy surface and rough surface, roughness Rz of the rough surface that is not surface treated is practically the same as or less than roughness Rz of the glossy surface, and the electrolyte comprises 0.5 to 40 mg/L of at least one sulfur contained compound selected from disulfur compound, dialkylamino-thioxomethyl-thioalkane sulfonic acid, or salts thereof; 1 to 1000 mg/L of one or more organic compounds selected from the group consisting of polyalkylene glycol based surfactant and low molecular gelatin; and 0.1 to 80 mg/L of chlorine ions, wherein the dialkylamino-thioxomethyl-thioalkane sulfonic acid, or salts thereof is dithio carbamic acid or salts thereof, the electrolyte further comprises 0.1 to 8 mg/L of a nitrogen contained compound of thiourea derivatives, the disulfur compound is SPS (bis-(3-sulfopropyl)-disulfide, disodium salt), and the organic compound is polyalkylene glycol based surfactant.
|
