发明名称 DIPPING APPARATUS OF CHIP
摘要 PURPOSE: A dipping apparatus of a chip is provided to uniformly and precisely apply ink by performing dipping and blotting processes using a servo motor through a palette method while a plurality of chips are inserted into the hole of a carrier plate. CONSTITUTION: The carrier plate into which the plurality of chips are inserted is inserted into a plate insertion apparatus(100). The first moving-up/down apparatus(110) moves up/down the carrier plate to dip the chip while holding the carrier plate inserted into the plate insertion apparatus one by one. A dipping apparatus(120) is installed under the first moving-up/down apparatus to dip the chip of the carrier plate held by the first moving-up/down apparatus. A transfer apparatus(130) horizontally transfers the carrier plate dipped in the dipping apparatus. The second moving-up/down apparatus(140) moves up/down the holds the carrier plate transferred from the transfer apparatus and moves up/down the carrier plate to blot the chip. A blotting apparatus(150) is installed under the second moving-up/down apparatus to blot the chip of the carrier plate held by the second moving-up/down apparatus. A plate overturning apparatus(160) overturns the chip to dry the chip of the carrier plate blotted in the blotting apparatus.
申请公布号 KR20030035508(A) 申请公布日期 2003.05.09
申请号 KR20010067609 申请日期 2001.10.31
申请人 SAMHWA CAPACITOR CO., LTD. 发明人 CHO, JAE YEON;PARK, JU SEOP
分类号 H01L21/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
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