发明名称 |
DIPPING APPARATUS OF CHIP |
摘要 |
PURPOSE: A dipping apparatus of a chip is provided to uniformly and precisely apply ink by performing dipping and blotting processes using a servo motor through a palette method while a plurality of chips are inserted into the hole of a carrier plate. CONSTITUTION: The carrier plate into which the plurality of chips are inserted is inserted into a plate insertion apparatus(100). The first moving-up/down apparatus(110) moves up/down the carrier plate to dip the chip while holding the carrier plate inserted into the plate insertion apparatus one by one. A dipping apparatus(120) is installed under the first moving-up/down apparatus to dip the chip of the carrier plate held by the first moving-up/down apparatus. A transfer apparatus(130) horizontally transfers the carrier plate dipped in the dipping apparatus. The second moving-up/down apparatus(140) moves up/down the holds the carrier plate transferred from the transfer apparatus and moves up/down the carrier plate to blot the chip. A blotting apparatus(150) is installed under the second moving-up/down apparatus to blot the chip of the carrier plate held by the second moving-up/down apparatus. A plate overturning apparatus(160) overturns the chip to dry the chip of the carrier plate blotted in the blotting apparatus.
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申请公布号 |
KR20030035508(A) |
申请公布日期 |
2003.05.09 |
申请号 |
KR20010067609 |
申请日期 |
2001.10.31 |
申请人 |
SAMHWA CAPACITOR CO., LTD. |
发明人 |
CHO, JAE YEON;PARK, JU SEOP |
分类号 |
H01L21/50;(IPC1-7):H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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