| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board using a bonding sheet for coverlay that maintains the original electrical insulating properties in the conventional coverlay film, at the same time, does not have a heat-resistant film as a support base, and can thin an entire film thickness as much as possible, and to provide the bonding sheet for coverlay. SOLUTION: In the circuit board, wiring is covered with the bonding sheet for coverlay that has a thickness of 3 to 100μm and does not have any coverlay films. In the bonding sheet for coverlay used for the circuit board, a peeling film is laminated on both the surfaces of an adhesive.
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