| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which ensures the prevention of short circuitings between adjacent lead portions by suppressing cream solder from flowing out of the lead portions, while retaining the sufficient coating amount of the cream solder in conducting the actual mounting of a semiconductor chip on a substrate and not permitting bond strength between the two to lower. SOLUTION: The semiconductor device 21 is provided with a semiconductor element 22, a lead frame having a plurality of lead portions 23 which extend to the semiconductor element 22, and a resin material 24 for sealing the semiconductor element 22 and the lead portions 23. The lead portions 23 extend to the under surface of the semiconductor element 22, and electrodes 25 of the semiconductor element 22 are mounted to the ends of the extending leads 23. A groove 33 for collecting solder is formed on the under surface of each lead portion 23. |
