| 摘要 |
<p>There is provided a plating apparatus and method which can control the temperature of a plating solution during plating more uniformly and easily form a uniform plated film on the to-be-plated surface of a workpiece, and which can simplify the device and decrease the footprint. The plating apparatus includes: a plating bath of a double bath structure (18) including an inner bath (14) for holding a plating solution and carrying out plating, and an outer bath (26) which surrounds the inner bath (14) and is in fluid communication therewith; and a heating device (30) disposed in the outer bath (26). The plating apparatus may further include means (32) for circulating or stirring the plating solution (12) in the plating bath (18).</p> |
