发明名称 MANUFACTURING METHOD FOR CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for a circuit board by which a taper angle is easily controlled and desired taper angle (e.g. in the range of 30-50 deg.) can stably be obtained. SOLUTION: This method includes a first process in which Al or a material layer primarily composed of Al is patterned and a prescribed pattern wiring is formed, and a second process in which a photoresist 100, having a prescribed size of aperture on the wiring is formed and a prescribed area of the wiring is etched with an etching solution including at least nitric acid. The concentration of the nitric acid in the etching solution in terms of the mass ratio is to be in the range of 11.3-12.78 mass%, the liquid temperature is to be in the range of 37.5-42.5 deg.C, and the etching rate is to be in the range of 200-400 nm/ min.
申请公布号 JP2003127397(A) 申请公布日期 2003.05.08
申请号 JP20010329528 申请日期 2001.10.26
申请人 CANON INC 发明人 FUJITA KATSURA;CHOUDOURI ERUSHADO ARI;UEICHI MASATO
分类号 B41J2/16;B41J2/05;(IPC1-7):B41J2/16 主分类号 B41J2/16
代理机构 代理人
主权项
地址