| 摘要 |
A method of reticle inspection, comprising generating a test reticle comprising a plurality of test pattern-features thereon; manufacturing a wafer using the reticle; and determining a transfer of at least one of said plurality of pattern features from said reticle to said wafer. Preferably, a neural network is trained using the determination. Preferably, a reticle is inspected by running detected defects through the neural network to determine if the detected defect has a consequence.
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