| 摘要 |
A modular jack assembly (1) includes an insulating housing (2) and an electrical subassembly (3) disposed within the housing. The electrical subassembly includes first and second contact array assemblies (32, 34) each having a PCB (320, 340) and a number of contacts (322, 342) attached on the PCB, front and rear magnetic modules (300, 300') respectively connected with the first and second PCBs, and a third PCB (36) containing signal conditioning components. The front and rear magnetic modules have upper pins (304, 304'), lower pins (306, 306') for soldering to a mother board and magnetic coils (31, 31 ') connecting with the upper and lower pins. The magnetic modules are electrically connecting with the first and second contacts via some of the upper pins thereof. The others of the upper pins of the magnetic modules are electrically connected to the signal conditioning components on the third PCB.
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