发明名称 |
THERMOSETTING EXPANDABLE RESIN COMPOSITION, LAMINATED SHEET, MOLDING AND STRUCTURE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting expandable resin composition which is excellent in heat stability, in which expansion ratio does not drop even when heated to a high temperature, and which is suitably used for the reinforcement of a car body and the like, and to provide a molding and a structural member using the thermosetting expandable resin composition. SOLUTION: The thermosetting expandable resin composition comprises a thermosetting resin composition and heat expansible microcapsules contained in the thermosetting resin composition. The heat expansible microcapsule is formed from an outer shell made of a polymer obtained by polymerizing monomer components including a nitrile monomer and a volatile blowing agent which is sealed within the outer shell and gasified at the softening temperature of the polymer or lower. |
申请公布号 |
JP2003128830(A) |
申请公布日期 |
2003.05.08 |
申请号 |
JP20020221514 |
申请日期 |
2002.07.30 |
申请人 |
SEKISUI CHEM CO LTD;TOKUYAMA SEKISUI IND CORP |
发明人 |
YOSHIDA KEIKO;OMURA TAKAHIRO;KAWAGUCHI YASUHIRO |
分类号 |
C08J9/32;B01J13/14;(IPC1-7):C08J9/32 |
主分类号 |
C08J9/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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