发明名称 THERMOSETTING EXPANDABLE RESIN COMPOSITION, LAMINATED SHEET, MOLDING AND STRUCTURE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting expandable resin composition which is excellent in heat stability, in which expansion ratio does not drop even when heated to a high temperature, and which is suitably used for the reinforcement of a car body and the like, and to provide a molding and a structural member using the thermosetting expandable resin composition. SOLUTION: The thermosetting expandable resin composition comprises a thermosetting resin composition and heat expansible microcapsules contained in the thermosetting resin composition. The heat expansible microcapsule is formed from an outer shell made of a polymer obtained by polymerizing monomer components including a nitrile monomer and a volatile blowing agent which is sealed within the outer shell and gasified at the softening temperature of the polymer or lower.
申请公布号 JP2003128830(A) 申请公布日期 2003.05.08
申请号 JP20020221514 申请日期 2002.07.30
申请人 SEKISUI CHEM CO LTD;TOKUYAMA SEKISUI IND CORP 发明人 YOSHIDA KEIKO;OMURA TAKAHIRO;KAWAGUCHI YASUHIRO
分类号 C08J9/32;B01J13/14;(IPC1-7):C08J9/32 主分类号 C08J9/32
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