发明名称 RESIN COMPOSITION AND MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition improved in mechanical strength, heat resistance, and a coefficient of linear expansion, by adding an inorganic filler to a thermoplastic resin, and simultaneously capable of being inhibited in deterioration of flexibility, such as deflecting and elongating characteristics, and to provide a molded product therefrom. SOLUTION: This resin composition is given by adding the scaly inorganic filler to the thermoplastic resin, wherein the resin has a melting point of >=300 deg.C, and the scaly inorganic filler has a heat of wetting of <=300 mJ/m<2> .
申请公布号 JP2003128944(A) 申请公布日期 2003.05.08
申请号 JP20010325253 申请日期 2001.10.23
申请人 OTSUKA CHEM CO LTD 发明人 KAMIFUKU ATSUSHI;ISHII YOSHIAKI;OTSUKA KENJIRO;YASUKI MINORU
分类号 C08J5/00;C08K3/00;C08L101/12;(IPC1-7):C08L101/12 主分类号 C08J5/00
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