发明名称 RESIN COMPOSITION AND MOLDED MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a resin composition suppressing the reduction of flexibility such as a bending property and elongation property while improving mechanical strength, heat resistance and linear expansion coefficient at the same time in spite of blending a scale-shaped inorganic filler with a thermoplastic resin, and a molded material of the same composition. SOLUTION: This resin composition is obtained by blending the scale-shaped inorganic filler consisting mainly of an acidic magnesium metasilicate, containing calcium as a small amount component and exhibiting <=100 ppm amount of elution of magnesium and <=100 ppm amount of elution of calcium on dispersing it in water with the thermoplastic resin having >=300 deg.C melting temperature, and the molded material is obtained by molding the resin composition.
申请公布号 JP2003128931(A) 申请公布日期 2003.05.08
申请号 JP20010325251 申请日期 2001.10.23
申请人 OTSUKA CHEM CO LTD 发明人 KAMIFUKU ATSUSHI;ISHII YOSHIAKI;OTSUKA KENJIRO;YASUKI MINORU
分类号 C08J5/00;C08K7/00;C08L101/00;(IPC1-7):C08L101/00 主分类号 C08J5/00
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