发明名称 |
Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
摘要 |
An adhesive-coated copper foil which comprises a copper foil and disposed on one side thereof a layer of an adhesive composition comprising (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as an optional ingredient, and (d) a compound having a triazine ring or isocyanuric ring. The adhesive layer has low hygroscopicity, excellent heat resistance, and satisfactory adhesion to copper foils. By using the adhesive-coated copper foil, a copper-clad laminate and a printed circuit board both having excellent properties can be obtained.
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申请公布号 |
US6558797(B1) |
申请公布日期 |
2003.05.06 |
申请号 |
US20010869050 |
申请日期 |
2001.06.22 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
ARATA MICHITOSHI;TAKANO NOZOMU;KOBAYASHI KAZUHITO |
分类号 |
C08G59/62;C09J7/02;C09J163/00;H05K3/38;H05K3/46;(IPC1-7):B32B27/38 |
主分类号 |
C08G59/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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