Seed layer

摘要

Disclosed are methods for repairing or enhancing discontinuous metal seed layers disposed on a substrate prior to subsequent metallization such as during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath, but comprise the steps of: contacting a metal seed layer disposed on a substrate with a copper colloid composition comprising a minor amount of ionizable palladium compound and a major amount of copper colloid particles to form a substantially continuous seed layer.