METHOD FOR RECYCLING NOTCH-SHAPED WAFER FOR FLAT-SHAPED WAFER

摘要

PURPOSE: A method for recycling a notch-shaped wafer for a flat-shaped wafer is provided to increase utilization rate of wafers by transforming a notch-shaped wafer into a flat-shaped wafer. CONSTITUTION: A transversal line(14) is formed on a notch-shaped wafer(10) adjacent to a bottom end(16) of a V-shaped notch formed at the notch-shaped wafer(10) by carrying out a scribing process using an UV(Ultra-Violet) laser(12) regulated at the laser power of 1-3 watt. The notch-shaped wafer(10) is cut along the transversal line(14) using a breaker as a cutting part. The cut portion of the notch-shaped wafer(10) is polished using an edge polisher at the speed of 0.4-100 mm/sec. The notch-shaped wafer(10) is then cleaned so as to remove contaminants generated during the edge polishing process, wherein the notch-shaped wafer(10) is completely transformed into a flat-shaped wafer.