ELECTROLYTIC COPPER FOIL FOR PCB HAVING BARRIER LAYER OF ZINC-COBALT-ARSENIC ALLOY AND SURFACE TREATMENT METHOD FOR ELECTROLYTIC COPPER FOIL

摘要

PURPOSE: An electrolytic copper foil and a surface treatment method therefor are provided to achieve improved adhesion with respect to the insulation substrate, while preventing corrosion of the facility. CONSTITUTION: An electrolytic copper foil(100) is characterized in that the copper foil has a barrier layer formed at the surface of the copper foil. The barrier layer is made of zinc-cobalt-arsenic alloy, wherein the zinc has a density of 0.1 to 20g/l, the cobalt has a density of 0.1 to 20g/l, and the arsenic has a density of 0.05 to 5g/l. The barrier layer has a thickness of 0.01 to 0.2 micron meter. A surface treatment method for the electrolytic copper foil is characterized in that the barrier layer made of zinc-cobalt-arsenic alloy is formed by performing an electrolytic treatment to the electrolytic copper foil by using an electrolyte containing 10 to 200g/l pyropotassium phosphate.