发明名称 |
Heater assembly for manufacturing a semiconductor device |
摘要 |
A heater assembly that is capable of uniformly heating a wafer in an apparatus for manufacturing a semiconductor device is provided. The heater assembly preferably includes a susceptor configured to support a substrate (wafer). A plurality of heaters can be disposed under the susceptor to heat the wafer. A support is preferably disposed below the heaters to support the heaters, and a power supply provides an electric current to operate the heaters. The support can include a heat-shielding portion that restricts heat conduction between the heaters. The heat-shielding portion preferably comprises heat-resistant material arranged in a groove formed on the support. The heat-shielding portion also preferably supports adjacent peripheral portions of the heaters. Electrical current provided to the heaters is preferably controlled such that the temperature of the heaters are operated in a range of about 390° C. to 420° C. Alternatively, a single or multiple ring-shaped heaters having an internal radiating space can be provided below a peripheral portion of the susceptor to uniformly heat the wafer.
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申请公布号 |
US2003080109(A1) |
申请公布日期 |
2003.05.01 |
申请号 |
US20020267549 |
申请日期 |
2002.10.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI CHUL-HWAN;JEON JIN-HO;KIM YONG-GAB;JANG SUNG-HWAN;LEE DONG-WON;LEE MIN-WOO;KIM KYUNG-TAE |
分类号 |
C23C16/46;H01L21/00;H01L21/02;H01L21/205;H01L21/68;(IPC1-7):H05B3/68 |
主分类号 |
C23C16/46 |
代理机构 |
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代理人 |
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地址 |
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