发明名称 |
Semiconductor wafer, method of manufacturing semiconductor wafer having bumps, semiconductor chip having bumps and method of manufacturing the same, semiconductor device, circuit board, and electronic equipment |
摘要 |
A semiconductor wafer includes a plurality of monolithic integrated circuits formed in a semiconductor crystal for realizing a function of a plurality of semiconductor chips; a plurality of pads formed in a plurality of first regions to be the plurality of semiconductor chips; and a conductor formed in a layer lower than the pads through a second region, which is located between two of the first regions, and electrically connecting at least two of the pads.
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申请公布号 |
US2003080422(A1) |
申请公布日期 |
2003.05.01 |
申请号 |
US20020268835 |
申请日期 |
2002.10.11 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
OHARA HIROSHI |
分类号 |
H01L23/12;H01L21/288;H01L21/60;H01L23/485;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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