| 发明名称 |
MULTILAYER RF AMPLIFIER MODULE |
| 摘要 |
An RF amplifier module (14) includes PC boards (18) laminated atop a bottom conductor plate (20). The boards include an RF semi-conductor amplifier chip (24) mounted in a well (22) extending to the bottom plate disposed in electrical connection with the chip. |
| 申请公布号 |
WO03037048(A1) |
申请公布日期 |
2003.05.01 |
| 申请号 |
WO2002US33445 |
申请日期 |
2002.10.21 |
| 申请人 |
MICRO MOBIO CORPORATION |
发明人 |
ICHITSUBO, IKUROH;WANG, GUAN-WU |
| 分类号 |
H01L23/13;H01L23/498;H01L23/66;H05K1/00;H05K1/16 |
主分类号 |
H01L23/13 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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