POLISHING COMPOUND, METHOD FOR PRODUCTION THEREOF AND POLISHING METHOD
摘要
A method for producing a polishing compound, which comprises dissolving a heterocyclic benzene compound such as benzotriazole in one or more organic solvents selected from the group consisting of a primary alcohol having 1 to 4 carbon atoms, a glycol having 2 to 4 carbon atoms, an ether represented by CH<sb>3</sb>CH(OH)CH<sb>2</sb>OC<sb>m</sb>H<sb>2m+1</sb >, wherein m is an integer of 1 to 4, N−methyl−2−pyrrolidone, N,N−dimethylformamide, dimethyl sulfoxide, ϝ−butyloractone and propylene carbonate, and then mixing the resulting solution with an aqueous dispersion of fine oxide particles as abrasive grains; and a polishing compound produced by the method. The use of the polishing compound for polishing a substrate having an insulating film (2) and, formed thereon, a wiring metal film (4) and a barrier film (3) allows the formation of an embedded wiring (5) being reduced in dishing, in erosion, and in scratch, with high polishing speed.
申请公布号
WO03036705(A1)
申请公布日期
2003.05.01
申请号
WO2002JP10996
申请日期
2002.10.23
申请人
ASAHI GLASS COMPANY, LIMITED;SEIMI CHEMICAL CO., LTD.;TAKEMIYA, SATOSHI;NAKAZAWA, NORIHITO;KON, YOSHINORI