CHIP INSERTION-TYPE SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A chip insertion-type semiconductor package is provided to increase the molding fidelity by improving the structure of an air vent. CONSTITUTION: A substrate(30) is provided with a chip hole, a conductive thin film, and a plurality of conductive ball lands. At this time, a semiconductor chip(1) is inserted into the chip hole. A plurality of conductive balls are attached on the conductive ball land of the rear surface of the substrate(30). The semiconductor chip(1) and a peripheral portion of the chip hole are molded by a molding part(7). A slit-type air vent(10) is formed on the front portion of the substrate(30) for exhausting the inner air to the outer portion of the resultant structure during the molding process. Preferably, the slit-type air vent(10) is formed from the chip hole to the edge portion of the substrate(30) and at least two slit-type air vents are formed on the substrate(30).