发明名称 High resolution patterning method
摘要 An object of the present invention to provide a method of preparing a substrate material such that it is capable of initiating a catalytic reaction over a pre-determined area of its surface. This is achieved by preparing a substrate so that it is capable of sponsoring a catalytic reaction over a pre-determined area of its surface by the steps of <SL> <LI>i) coating some or all of the substrate material with a first layer material, the first layer material comprising a catalytic material; <LI>ii) coating the first layer material with a second layer material, the second layer being incapable of promoting and/or sustaining the desired catalytic reaction; and <LI>iii) using a scribing process to remove a pre-determined pattern of material from the second layer material in order to expose the first layer material. Scribing is carried out by ablating patterns by the use of energetic media such as lasers or electron beams. </SL> After carrying out this process an autocatalytic plating layer may be applied to the exposed areas. The second layer material may be applied as an ink formulation and may include binders and fillers.
申请公布号 GB2381274(A) 申请公布日期 2003.04.30
申请号 GB20010025815 申请日期 2001.10.29
申请人 * QINETIQ LIMITED 发明人 DANIEL ROBERT * JOHNSON;WILLIAM NORMAN * DAMERELL;ANTHONY WILLIAM NIGEL * KYNASTON-PEARSON;STEPHEN GEORGE * APPLETON;GREGORY PETER WADE * FIXTER
分类号 C23C18/16;C23C18/18;C23C18/30;C23C18/34;H05K3/00;H05K3/18;(IPC1-7):C23C18/16;C23C18/28 主分类号 C23C18/16
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