| 摘要 |
The power semiconductor (13) is secured to a face (121,122) of a substrate (12) of electrically insulating material, with substrate fastened to at least one fastening surface (11) of the module (1).The substrate face, securing the power semiconductor, forms an angle (alpha) with the fastening surface of the module. W.r.t. the power semiconductor on the face, sticking out of the fastening surface, is fitted a spray nozzle (14) for a coolant (15) of the power semiconductor. |
