发明名称 PROCESS AND DEVICE FOR THE SHAPING OF LEADS OF INTEGRATED CIRCUITS
摘要 METHOD AND APPARATUS FOR FORMING THE LEAD-OUTS (14) OF INTEGRATED CIRCUITS FROM WHICH LEAD-OUTS (14) WHICH ARE POSITIONED IN A COMMON PLANE (21) ARE PROTRUDING, ARE BENT IN THAT THEY ARE GRIPPED CLOSE TO THEIR FREE TIPS AND THEN ARE POSITIVELY MOVED ALONG A CURVED PATH WHICH IS SITUATED IN A PLANE EXTENDING PERPENDICULAR TO SAID COMMON PLANE (21) AND COMPRISING THE RESPECTIVE ONES OF THE LEAD-OUTS (14) WHILE THE LEAD-OUTS (14) MAINTAIN TO BE CLAMPED. (FIG. 3)
申请公布号 MY115135(A) 申请公布日期 2003.04.30
申请号 MYPI9302113 申请日期 1993.10.14
申请人 MICRON TECHNOLOGY, INC. 发明人 GERHARD HINTERLECHNER
分类号 B21D5/01;B21F45/00;H01L21/48;H01L23/50;H05K13/00 主分类号 B21D5/01
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