摘要 |
METHOD AND APPARATUS FOR FORMING THE LEAD-OUTS (14) OF INTEGRATED CIRCUITS FROM WHICH LEAD-OUTS (14) WHICH ARE POSITIONED IN A COMMON PLANE (21) ARE PROTRUDING, ARE BENT IN THAT THEY ARE GRIPPED CLOSE TO THEIR FREE TIPS AND THEN ARE POSITIVELY MOVED ALONG A CURVED PATH WHICH IS SITUATED IN A PLANE EXTENDING PERPENDICULAR TO SAID COMMON PLANE (21) AND COMPRISING THE RESPECTIVE ONES OF THE LEAD-OUTS (14) WHILE THE LEAD-OUTS (14) MAINTAIN TO BE CLAMPED. (FIG. 3)
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