发明名称 |
Semiconductor package leadframe assembly and method of manufacture |
摘要 |
A semiconductor package and the leadframe therefor having a reverse-down set part formed in the tie bar supporting the chip paddle. The reverse-down set part of the tie bar may be formed by a mechanical stamping process in such a way that it is present within the insulating body, interlocking therewith. This feature also facilitates the prevention of a short circuit between the tie bar that is exposed externally from the package body and the exposed internal lead through solder upon the mounting of a semiconductor package onto a motherboard.
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申请公布号 |
US6555899(B1) |
申请公布日期 |
2003.04.29 |
申请号 |
US20000687541 |
申请日期 |
2000.10.13 |
申请人 |
AMKOR TECHNOLOGY, INC. |
发明人 |
CHUNG YOUNG SUK;JANG SUNG SIK;YEE JAE HAK |
分类号 |
H01L23/48;H01L23/31;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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