| 摘要 |
A package structure of a hybrid device in an optical signal transmitter comprises an assembly of a surface emitting laser (SEL), photodiodes, an IC and a passive device, and its application. The package structure further comprises a submount to reduce parasitic capacitance and increase coupling efficiency of the device to the optical fiber, and an electric connect region is formed on the submount to shorten the length of wire and improve the yield. A combination of the SEL and the pair of photodiodes can further applies on a duplexer of single optical fiber.
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