发明名称 |
Method for assembling a tiled, flat-panel microdisplay array having reflective microdisplay tiles and attaching thermally-conductive substrate |
摘要 |
This invention describes fabrication techniques for producing microdisplays suitable for combining into tiled, flat-panel displays having visually imperceptible seams. Assembly techniques to overcome flatness requirements imposed by tiled, flat-panel display assemblies are also described. Edge treatment techniques for individual microdisplays while still part of the silicon die or wafer are also described. The use of these inventive techniques allows the assembly microdisplays into tiled, flat-panel that are appear visually seamless and optically uniform.
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申请公布号 |
US6556261(B1) |
申请公布日期 |
2003.04.29 |
申请号 |
US20000597662 |
申请日期 |
2000.06.21 |
申请人 |
RAINBOW DISPLAYS, INC. |
发明人 |
KRUSIUS J. PETER;SERAPHIM DONALD P. |
分类号 |
G02F1/1333;G02F1/1362;(IPC1-7):G02F1/133;G02F1/133;G02F1/134 |
主分类号 |
G02F1/1333 |
代理机构 |
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