发明名称 |
Semiconductor device and producing method thereof |
摘要 |
The present invention is a method of producing a semiconductor device in which at least one alignment mark to be used in an exposure process of a lithographic process is formed of a wiring material which is copper or includes copper as a main component, and the alignment mark is formed entirely in an area outside an area where dicing is to be executed.
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申请公布号 |
US6555925(B1) |
申请公布日期 |
2003.04.29 |
申请号 |
US20000517187 |
申请日期 |
2000.03.02 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HIGASHI KAZUYUKI;MATSUNAGA NORIAKI;KAJITA AKIHIRO;TAKASE TAMAO;KANEKO HISASHI;SHIBATA HIDEKI |
分类号 |
H01L21/301;H01L23/544;(IPC1-7):H01L23/544 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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