摘要 |
PURPOSE: An apparatus for measuring the number of wafer in semiconductor device manufacturing equipment is provided to keep the gap between wafers installed in a carrier equal when the carrier is installed in a plate for counting the number of wafer. CONSTITUTION: Lots of wafers are installed in each slot(110) in a carrier(100). An opening for counting a device(300) is formed on the bottom part of the carrier, on each corner of which a step is formed. Four plates(200) are prepared for the carrier to be installed on it. When the carrier is installed on the plates, the steps are seated on the four blocks(210,220,230,240) of the plates. Two blocks in a side parallel to the wafers are lifted up about 3 mm higher than other two block in the opposite side so that the carrier leans to a side by a predetermined angle theta.
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