| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can improve transmission characteristics of a signal, regarding a wiring board wherein a signal conductor wire for transmitting a high frequency signal is formed on a board surface. SOLUTION: The wiring board 101 is provided with the signal conductor wire 126 or the like on the substrate surface 112, a surface side first ground layer 129K or the like extending to one side of the signal conductor wire 126 or the like, and a surface side second ground layer 129L or the like stretching to the other side. A rear side ground layer 131 is disposed inside the board. A first conductor 132K and a second conductor 132L, or the like whose sections are slender along the signal conductor wire 126 or the like are disposed which connect the surface side first and second ground layers 129K, 129L or the like with the rear side ground layer 131 in the vicinity of the signal conductor wire 126 or the like. |
