| 摘要 |
PROBLEM TO BE SOLVED: To prevent a resin from being peeled when thermal stress acts and improve a reliability. SOLUTION: A semiconductor device 11 radiates heat through a pair of heat radiating plates 13 and 14 from both the surfaces of a heat generating element 12. Substantially, the entire part of the device is formed by molding a resin 18. A solder layer for connecting the heat generating element 12 to the heat radiating plates 13 and 14 is provided. A polyamide resin 16 applied to the surfaces of the heat radiating plates 13 and 14 is provided for improving an adhesion to the resin 18. The thickness of application of the polyamide resin 16 is about 20% or less as low as the thickness dimension of the solder layer. |
