| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cooler capable of continuously bringing a heat radiating component into contact with the surface of an object to be cooled thoroughly by as small pressing force as possible. SOLUTION: The cooler comprises a heat conductive fluid 23 interposed between an electronic component 19 and a heat sink 14. The fluid 23 enhances a contact between the component 19 and the heat sink 14 and simultaneously performs a predetermined adsorption force based on its fluidity. The adsorption force allows the side slip of the heat sink 14 along the surface of the component 19 but restricts the displacement of the heat sink 14 in a vertical direction perpendicularly crossing with the surface of the component 19. The heat sink 14 can be held on the component 19 at the atmospheric pressure. Since the slide slip of the heat sink 14 is restricted, the fluid 23 is assured in a sufficient spread between the heat sink 14 and the component 19 irrespective of the inclination and the vibration of the component 19. The fluid 23 continuously performs the sufficient adsorption force.</p> |
